Substrate processing system
US10518382B2 · kind B2 · utility
5Cited by
1References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2016 |
| Grant date | Dec 31, 2019 |
| Priority date | — |
| Expiry date | Feb 16, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing system comprising a polishing part, a pre-cleaning region, and a cleaning part. The polishing part performs a Chemical Mechanical Polishing (CMP) process on a substrate. The pre-cleaning region is prepared in the polishing part and allows pre-cleaning performed on the substrate having undergone the polishing process. The cleaning part cleans the substrate pre-cleaned in the pre-cleaning region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.