Laminated substrate
US10518503B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 2018 |
| Grant date | Dec 31, 2019 |
| Priority date | — |
| Expiry date | Aug 21, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/178
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A laminated substrate including a halogen-free epoxy resin composition. The halogen-free epoxy resin composition includes 100 parts by weight of a halogen-free naphthalene type epoxy resin, 10 to 25 parts by weight of a DOPO modified curing agent, 25 to 45 parts by weight of a cyanate resin, 35 to 60 parts by weight of bismaleimide, 45 to 65 parts by weight of a non-DOPO flame retardant, and 0.5 to 15 parts by weight of a curing accelerator. The laminated substrate of the present disclosure includes a halogen-free epoxy resin composition which has the characteristic of high transition temperature, so that the halogen-free epoxy resin composition has low dielectric constant, low dissipation factor, high heat resistance and high storage modulus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.