ITEQ CORPORATION
23Patents
23Active
23Granted
49Portfolio score
Filing activity: Nov 8, 2007 → Dec 25, 2022 · 11 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8058363B2 | Varnish and prepreg, and substrates thereof | Emerging Cross-Sectional Technologies | 4 | Active |
| US9674992B2 | Electromagnetic interference shielding film | Electricity | 2 | Active |
| US8663803B2 | Varnish composition, and pre-impregnated manufacture thereof | Emerging Cross-Sectional Technologies | 1 | Active |
| US7842401B2 | Halogen-free varnish and prepreg thereof | Emerging Cross-Sectional Technologies | 1 | Active |
| US7612049B2 | Method of inhibition the growth of algae | Human Necessities | 1 | Active |
| US8104148B2 | Kind of prepolymer and its product-thermosetting resins composite | Emerging Cross-Sectional Technologies | 1 | Active |
| US8217099B2 | Thermosetting resin composition | Chemistry; Metallurgy | 1 | Active |
| US8153709B2 | Halogen-free prepreg and resin for preparing the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US10611910B2 | Halogen-free epoxy resin composition having low dielectric loss | Chemistry; Metallurgy | 0 | Active |
| US10696783B2 | Resin composition, prepreg, and copper clad laminate | Electricity | 0 | Active |
| US8206819B2 | Varnish, prepreg, and substrate thereof | Emerging Cross-Sectional Technologies | 0 | Active |
| US11503708B2 | Resin composition, prepreg, and printed circuit board | Electricity | 0 | Active |
| US9257212B2 | Dielectric material with low dielectric loss | Electricity | 0 | Active |
| US7955701B2 | Prepreg and resin for preparing the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US10518503B2 | Laminated substrate | Electricity | 0 | Active |
| US10752744B2 | Thermally conductive resin, resin composition, prepreg, and copper clad laminate | Electricity | 0 | Active |
| US8088490B2 | Varnish, prepreg, and substrate thereof | Emerging Cross-Sectional Technologies | 0 | Active |
| US7786029B2 | Resin composition and application thereof | Emerging Cross-Sectional Technologies | 0 | Active |
| US9455067B2 | Low dielectric materials | Electricity | 0 | Active |
| US12415339B2 | Resin composition and metal clad substrate | Chemistry; Metallurgy | 0 | Active |
| US8017671B2 | Thermosetting resin for expediting a thermosetting process | Chemistry; Metallurgy | 0 | Active |
| US9771456B2 | Polyimide resins containing polymaleic anhydride and method for manufacturing the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US9245667B2 | Circuit board | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.