Patent · US Active

Method of forming dual-cure nanostructure transfer film

US10518512B2 · kind B2 · utility

0Cited by

20References

15Claims

0Family size

Assignee

3M INNOVATIVE PROPERTIES COMPANY · US

Inventors

Evan L. Schwartz · Teaneck, US
Shijing Cheng · Woodbury, US
Claire Hartmann-Thompson · Lake Elmo, US

Key dates

Filing date	Mar 31, 2015
Grant date	Dec 31, 2019
Priority date	—
Expiry date	Mar 31, 2035

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08J2335/02
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method of forming a transfer film is described. The transfer film includes a template layer having a first major surface and an opposing second major surface. The second major surface includes a structured non-planar release surface. A backfill layer is disposed upon and conforms to the non-planar structured surface. The backfill layer includes a first cross-linked polymer and a plurality of multifunctional monomers, which cure via different and independent curing mechanisms.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.