Package structure having under ball release layer and manufacturing method thereof
US10522438B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 2017 |
| Grant date | Dec 31, 2019 |
| Priority date | — |
| Expiry date | Jan 24, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure includes a redistribution layer, a chip, an encapsulant, a plurality of under ball release layers, and a plurality of solder balls. The redistribution layer includes a first surface, a second surface opposite to the first surface, and a patterned circuit layer, wherein the patterned circuit layer includes a plurality of pads protruding from the first surface. The chip is disposed on the second surface and electrically connected to the patterned circuit layer. The encapsulant is disposed on the second surface and encapsulates the chip. The under ball release layers cover the pads respectively. The solder balls are disposed on the under ball release layers and electrically connected to the pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.