Precursor composition, photosensitive resin composition, method for producing precursor composition, cured film, method for producing cured film, and semiconductor device
US10526448B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2017 |
| Grant date | Jan 7, 2020 |
| Priority date | — |
| Expiry date | Dec 22, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F2500/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided are photosensitive resin compositions having a wide exposure latitude, a precursor composition for providing such a photosensitive resin composition, a method for producing a precursor composition, a cured film, a method for producing a cured film; and a semiconductor device. The precursor composition is a precursor composition containing at least one kind of heterocycle-containing polymer precursor, in which the heterocycle-containing polymer precursor is selected from a polyimide precursor and a polybenzoxazole precursor; and the dispersity which is a weight-average molecular weight/a number-average molecular weight of the heterocycle-containing polymer precursor is 2.5 or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.