Probe head with inductance reducing structure
US10527647B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Jun 22, 2018 |
| Grant date | Jan 7, 2020 |
| Priority date | — |
| Expiry date | Jul 7, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07371
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Improved impedance matching is provided in vertical probe arrays having conductive guide plates by providing ground pins connecting the guide plates that do not mechanically touch the device under test or the input test apparatus. Such ground pins can be disposed in predetermined patterns around corresponding signal probes to improve an impedance match between the probes and the test apparatus and/or the device under test. Preferably all impedances are matched to 50Ω as is customary for high frequency work.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.