Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
US10529605B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2018 |
| Grant date | Jan 7, 2020 |
| Priority date | — |
| Expiry date | Sep 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67781
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a technique includes: a substrate holder including a heat insulating part and a substrate holding part disposed above the heat insulating part and holding substrates in multiple stages; a process chamber processing the substrates held by the substrate holding part; a transfer chamber adjacent to the process chamber and transferring the substrates to the substrate holding part; a transfer mechanism transferring the substrate holder; a first gas supply part installed on one side of the transfer chamber and supplying gas into the transfer chamber; a second gas supply part having gas outlets at a height position between the substrate held at a lowermost stage of the substrate holding part and the heat insulating part and supplying a gas toward the substrate holder; and a controller controlling the transfer mechanism, the first gas supply part and the second gas supply part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.