Systems and methods for replaceable bail grid array (BGA) packages on board substrates
US10531575B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Apr 1, 2016 |
| Grant date | Jan 7, 2020 |
| Priority date | — |
| Expiry date | Apr 1, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The systems and methods described herein are directed to using a plurality of interface elements (e.g., sockets) and/or stud-bump elements embedded into board substrates (e.g., a motherboard) to enable the interchange of variable configuration components (e.g., electronic components, chips, and the like) that are mounted on package substrates having ball grid arrays (BGAs). In some aspects, this interchange can be accomplished while leaving the pre-existing board substrate design and various peripheral system components of the board substrate unchanged.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.