System and method for heat treatment of substrates
US10535538B2 · kind B2 · utility
Inventor
Key dates
| Filing date | Jan 26, 2018 |
| Grant date | Jan 14, 2020 |
| Priority date | — |
| Expiry date | Jan 26, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system and/or method for heat treatment of substrates. The system includes a housing that defines a heating chamber and a door assembly that encloses an opening of the heating chamber. The door assembly may be opened and closed. When opened, the door assembly defines a loading slot for loading substrates into and unloading substrates from the heating chamber. The door assembly is coupled to a first actuator and a control unit is coupled to the actuator to move the door assembly between a plurality of loading positions. The system may also include a loading assembly mounted to the door assembly to facilitate insertion and removal of substrates from the heating chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.