Patent · US Active

Semiconductor device package and method of manufacturing the same

US10535612B2 · kind B2 · utility

4Cited by
2References
19Claims
0Family size

Assignee

Inventor

Key dates

Filing dateDec 15, 2017
Grant dateJan 14, 2020
Priority date—
Expiry dateDec 15, 2037

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/3025
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A semiconductor device package includes a substrate, a first electronic component, a first package body, an electrical contact and a first conductive layer. The substrate has a first surface, a second surface and a lateral surface extending between the first surface and the second surface. The first electronic component is disposed on the first surface of the substrate. The first package body encapsulates the first electronic component. The electrical contact is disposed on the second surface of the substrate. The first conductive layer includes a first portion and a second portion. The first portion is disposed on the first package body and the lateral surface of the substrate. The second portion contacts the electrical contact.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.