System and method for the fluidic assembly of micro-LEDs utilizing negative pressure
US10535640B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2017 |
| Grant date | Jan 14, 2020 |
| Priority date | — |
| Expiry date | Jan 30, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15153
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An emissive panel and associated assembly method are provided. The method provides an emissive substrate having an insulating layer with a top surface and a back surface, and a dielectric layer overlying the insulating layer patterned to form a plurality of wells. Each well has a bottom surface formed on the insulating layer top surface with a first electrical interface electrically connected to a first conductive pressure channel (CPC). The CPCs are each made up of a pressure via with sidewalls formed between the well bottom surface and the insulating layer back surface. A metal layer coats the sidewalls, and a medium flow passage formed interior to the metal layer. The method uses negative pressure through the CPCs to help capture emissive elements in a liquid flow deposition process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.