Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring board
US10537021B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 21, 2018 |
| Grant date | Jan 14, 2020 |
| Priority date | — |
| Expiry date | Dec 21, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1461
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A three-dimensional wiring board production method is provided that includes: a preparation step of preparing a resin film (1) having a breaking elongation of 50% or more; a first metal film formation step of forming a first metal film (3) on a surface of the resin film; a pattern formation step of performing patterning on the first metal film to form a desired pattern; a three-dimensional molding step of performing three-dimensional molding by heating and pressurizing the resin film; and a second metal film formation step of forming a second metal film (21) on the first metal film having a pattern formed thereon. In the first metal film formation step, metal is deposited in a particle state to form the first metal film in a porous state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.