MEIKO ELECTRONICS CO., LTD.
32Patents
22Active
32Granted
47Portfolio score
Filing activity: Jun 9, 1986 → Mar 11, 2021 · 2 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4790902A | Method of producing conductor circuit boards | Emerging Cross-Sectional Technologies | 45 | Expired |
| US5049221A | Process for producing a copper-clad laminate | Electricity | 38 | Expired |
| US6239983A | Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board | Emerging Cross-Sectional Technologies | 32 | Expired |
| US5096522A | Process for producing copper-clad laminate | Electricity | 29 | Expired |
| US5886877A | Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board | Emerging Cross-Sectional Technologies | 29 | Expired |
| US4889584A | Method of producing conductor circuit boards | Emerging Cross-Sectional Technologies | 25 | Expired |
| US6350957B1 | Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board | Emerging Cross-Sectional Technologies | 17 | Expired |
| US4850664A | Connector for optical fiber | Physics | 16 | Expired |
| US10385076B2 | Surface treatment agent and novel compound | Emerging Cross-Sectional Technologies | 5 | Active |
| US4883575A | Apparatus for continuously producing a base for a printed circuit board | Electricity | 5 | Expired |
| US7800917B2 | Printed wiring board | Electricity | 4 | Active |
| US9790242B2 | Surface treatment method, surface treatment agent, and novel compound | Emerging Cross-Sectional Technologies | 4 | Active |
| US9326376B2 | Printed wiring board | Electricity | 2 | Active |
| US8921706B2 | Component-embedded substrate, and method of manufacturing the component-embedded substrate | Emerging Cross-Sectional Technologies | 2 | Active |
| US9320185B2 | Method of manufacturing a component-embedded substrate | Electricity | 2 | Active |
| US10244624B2 | Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring board | Electricity | 2 | Active |
| US9593423B2 | Process for forming metal film, and product equipped with metal film | Emerging Cross-Sectional Technologies | 1 | Active |
| US10665568B2 | Encapsulated circuit module, and production method therefor | Electricity | 1 | Active |
| US9363885B1 | Method of fabricating heat dissipating board | Electricity | 1 | Active |
| US11128190B2 | Rotary machine coil using a winding electric wire | Electricity | 1 | Active |
| US9185811B2 | Method of producing printed circuit board, and printed board produced by the method | Electricity | 0 | Active |
| US10537021B2 | Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring board | Electricity | 0 | Active |
| US12009282B2 | Memory device and memory device module | Electricity | 0 | Active |
| US9596765B2 | Manufacturing method for component incorporated substrate and component incorporated substrate manufactured using the method | Electricity | 0 | Active |
| US9526182B2 | Component-embedded substrate manufacturing method | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.