Polyimide precursor composition, photosensitive resin composition, cured film, method for producing cured film, a semiconductor device, and method for producing polyimide precursor composition
US10538627B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2017 |
| Grant date | Jan 21, 2020 |
| Priority date | — |
| Expiry date | Nov 28, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15174
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin composition using a polyimide precursor composition, a cured film, a method for producing a cured film, a semiconductor device, and a method for producing a polyimide precursor composition are provided. In the polyimide precursor composition, the molar ratio of repeating units represented by General Formula (1-2) among structural isomers of the polyimide precursor is 60% to 90% by mole. In General Formula (1-2), A1 and A2 each independently represents an oxygen atom or NH, R111 and R112 each independently represents a single bond or a divalent organic group, and R113 and R114 each independently represents a hydrogen atom or a monovalent organic group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.