Vinylbenzyl imide resin, method of preparing vinylbenzyl imide resin, vinylbenzyl imide prepolymer, resin composition and article made therefrom
US10538628B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 30, 2017 |
| Grant date | Jan 21, 2020 |
| Priority date | — |
| Expiry date | Feb 23, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/022
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a vinylbenzyl imide resin useful in conjunction with other components to prepare a resin composition for making such as a prepreg, a resin film, a resin film with copper foil, a laminate or a printed circuit board, having improved one or more properties including resin flow, resin filling property, flame retardancy, glass transition temperature, thermal resistance, dielectric constant, dissipation factor and interlayer bonding strength. Also disclosed is a method of preparing the vinylbenzyl imide resin, its prepolymer, a resin composition comprising the vinylbenzyl imide resin and/or its polymer and an article made therefrom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.