ELITE MATERIAL CO., LTD.
53Patents
53Active
53Granted
52Portfolio score
Filing activity: Sep 22, 2011 → Dec 14, 2022
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8404764B1 | Resin composition and prepreg, laminate and circuit board thereof | Chemistry; Metallurgy | 5 | Active |
| US9005761B2 | Halogen-free resin composition and its application for copper clad laminate and printed circuit board | Emerging Cross-Sectional Technologies | 3 | Active |
| US9428646B2 | Low dielectric halogen-free resin composition and circuit board using the same | Emerging Cross-Sectional Technologies | 2 | Active |
| US11066520B2 | Vinyl-modified maleimide, composition and article made thereby | Electricity | 2 | Active |
| US9422412B2 | Halogen-free resin composition and copper clad laminate and printed circuit board using same | Emerging Cross-Sectional Technologies | 2 | Active |
| US9000077B2 | Phosphazene compound having vinyl group, resin composition containing the same, and circuit board manufactured from the same | Performing Operations; Transporting | 1 | Active |
| US11111383B2 | Resin composition and article made therefrom | Chemistry; Metallurgy | 1 | Active |
| US10774210B2 | Resin composition and article made therefrom | Chemistry; Metallurgy | 1 | Active |
| US10717807B1 | Epoxy resin composition and article made therefrom | Chemistry; Metallurgy | 1 | Active |
| US10894865B2 | Prepolymerized resin, preparation method thereof, resin composition comprising the same, and article made therefrom | Chemistry; Metallurgy | 1 | Active |
| US9545018B2 | Multi-layer printed circuit boards with dimensional stability | Electricity | 1 | Active |
| US9926435B2 | Resin composition, copper-clad laminate using the same, and printed circuit board using the same | Electricity | 1 | Active |
| US12378412B2 | Resin composition and article made therefrom | Chemistry; Metallurgy | 0 | Active |
| US11434366B2 | Resin composition and article made therefrom | Chemistry; Metallurgy | 0 | Active |
| US11760876B2 | Resin composition and article made therefrom | Chemistry; Metallurgy | 0 | Active |
| US11384239B2 | Resin composition and article made therefrom | Chemistry; Metallurgy | 0 | Active |
| US11618820B2 | Resin composition and article made therefrom | Chemistry; Metallurgy | 0 | Active |
| US10618993B2 | Phosphorus-containing olefin polymer, method for preparing the same, and composition and article comprising the same | Electricity | 0 | Active |
| US9403981B2 | Low dielectric resin composition, and resin film, prepreg, printed circuit board made thereby | Electricity | 0 | Active |
| US11840630B2 | Resin composition and article made therefrom | Chemistry; Metallurgy | 0 | Active |
| US11840628B2 | Resin composition and article made therefrom | Chemistry; Metallurgy | 0 | Active |
| US10538628B2 | Vinylbenzyl imide resin, method of preparing vinylbenzyl imide resin, vinylbenzyl imide prepolymer, resin composition and article made therefrom | Electricity | 0 | Active |
| US9394438B2 | Resin composition, copper-clad laminate and printed circuit board for use therewith | Emerging Cross-Sectional Technologies | 0 | Active |
| US11572469B2 | Resin composition and article made therefrom | Chemistry; Metallurgy | 0 | Active |
| US11566127B2 | Resin composition and article made therefrom | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.