Heat transfer device incorporating a helical flow element within a fluid conduit
US10539371B2 · kind B2 · utility
0Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2018 |
| Grant date | Jan 21, 2020 |
| Priority date | — |
| Expiry date | Jan 18, 2038 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D7/02
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A liquid heat transfer device with improved heat transfer into a heating or cooling fluid is disclosed. The heat transfer device incorporates an element which creates a helical flow path through a fluid conduit to more efficiently dissipate heat within a space-constrained environment without increasing the diameter or overall length of the fluid conduit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.