Epoxy resin composition, prepreg and laminate prepared therefrom
US10544255B2 · kind B2 · utility
1Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2016 |
| Grant date | Jan 28, 2020 |
| Priority date | — |
| Expiry date | Mar 17, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2203/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to an epoxy resin composition, comprising the following components: (A) an epoxy resin containing oxazolidinone structure having the structure of the formula (1), (B) an active ester curing agent, and (C) a curing accelerator. The epoxy composition, prepreg, laminate and printed circuit board prepared from such epoxy composition have the following features of low coefficient of thermal expansion, low dielectric loss factor Df less than or equal to 0.0084, low water absorption and excellent moisture and heat resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.