Patent · US Active

System and method for a transducer in an eWLB package

US10546752B2 · kind B2 · utility

1Cited by

14References

14Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Stephan Pindl · Ergoldsbach, DE
Daniel Lugauer · Wörth an der Donau, DE
Dominic Maier · Pleystein, DE
Alfons Dehe · Reutlingen, DE

Key dates

Filing date	Dec 20, 2018
Grant date	Jan 28, 2020
Priority date	—
Expiry date	Dec 20, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.