Buried electrode geometry for lowering surface losses in superconducting microwave circuits
US10546992B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2018 |
| Grant date | Jan 28, 2020 |
| Priority date | — |
| Expiry date | Jun 28, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N69/00
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Embodiments are directed to a superconducting microwave circuit. The circuit includes a substrate and two electrodes. The latter form an electrode pair dimensioned so as to support an electromagnetic field, which allows the circuit to be operated in the microwave domain. The substrate exhibits a raised portion, which includes a top surface and two lateral surfaces. The top surface connects the two lateral surfaces, which show respective undercuts (on the lateral sides of the raised portions). Each of the electrodes includes a structure that includes a potentially superconducting material. Two protruding structures are accordingly formed, which are shaped complementarily to the respective undercuts. This way, the shaped structure of each of the electrodes protrudes toward the other one of the electrodes of the pair.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.