Cooling electronic devices in a data center
US10548240B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2019 |
| Grant date | Jan 28, 2020 |
| Priority date | — |
| Expiry date | Jan 11, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member that includes a first number of inlet ports and a second number of outlet ports that are in fluid communication with a cooling liquid flow path defined through the heat transfer member, the first number of inlet ports being different that the second number of outlet ports.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.