Jorge Padilla
24Patents
7h-index
16Co-inventors
62Inventor score
Filing activity: May 10, 2013 → Oct 21, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10548240B1 | Cooling electronic devices in a data center | Physics | 14 | Active |
| USD727437S1 | Rocket balloon | General | 10 | Active |
| USD739473S1 | Rocket balloon | General | 9 | Active |
| USD738960S1 | Rocket balloon | General | 9 | Active |
| USD739472S1 | Rocket balloon | General | 8 | Active |
| US10966352B2 | Cooling electronic devices in a data center | Physics | 8 | Active |
| USD738961S1 | Rocket balloon | General | 7 | Active |
| US10548239B1 | Cooling electronic devices in a data center | Physics | 5 | Active |
| US10645847B2 | Cooling electronic devices in a data center | Physics | 4 | Active |
| USD727436S1 | Rocket balloon | General | 4 | Active |
| US10083920B1 | Package stiffener for protecting semiconductor die | Electricity | 4 | Active |
| USD727435S1 | Rocket balloon | General | 3 | Active |
| US10761577B1 | Liquid soluble gas sealed cooling system | Electricity | 1 | Active |
| US10852789B1 | Liquid soluble gas sealed cooling system | Electricity | 1 | Active |
| US11158566B2 | Integrated circuit with a ring-shaped hot spot area and multidirectional cooling | Electricity | 1 | Active |
| US11488890B2 | Direct liquid cooling with O-ring sealing | Emerging Cross-Sectional Technologies | 1 | Active |
| US10468359B2 | Package stiffener for protecting semiconductor die | Electricity | 1 | Active |
| US11042200B2 | Liquid soluble gas sealed cooling system | Electricity | 0 | Active |
| US12315783B2 | Integrated circuit with a ring-shaped hot spot area and multidirectional cooling | Electricity | 0 | Active |
| US10681846B2 | Cooling electronic devices in a data center | Electricity | 0 | Active |
| US12342508B2 | Continuous feed liquid coolant replacement | Electricity | 0 | Active |
| US11832396B2 | Cooling electronic devices in a data center | Electricity | 0 | Active |
| US12272619B2 | Direct liquid cooling with O-ring sealing | Emerging Cross-Sectional Technologies | 0 | Active |
| US12315782B2 | Spring loaded compliant coolant distribution manifold for direct liquid cooled modules | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.