Shielding in electronic assemblies
US10548249B2 · kind B2 · utility
8Cited by
4References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2017 |
| Grant date | Jan 28, 2020 |
| Priority date | — |
| Expiry date | Sep 27, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are arrangements for shielding in electronic assemblies, as well as related methods and devices. In some embodiments, an electronic assembly may include a circuit board having a first face and a second opposing face, and a shield coupled to the second face of the circuit board. The circuit board may have a hole extending therethrough, and the shield may extend into the hole towards the first face.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.