System and method for controlling semiconductor manufacturing facility, method of manufacturing integrated circuit using the system and method, and method of manufacturing processor using the system and method
US10553464B2 · kind B2 · utility
1Cited by
4References
20Claims
0Family size
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Key dates
| Filing date | Apr 11, 2018 |
| Grant date | Feb 4, 2020 |
| Priority date | — |
| Expiry date | Jul 26, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for controlling a semiconductor manufacturing facility includes measuring output change amounts of differential pressure sensors in the facility when pressure conditions change by a number of fans. The fans are then classified into different groups and subgroups and control sequences of the subgroups are determined based on the change amounts. Difference values are then calculated, and a control signal is generated to adjust the rotation speed of the fans.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.