Semiconductor package with EMI shield and fabricating method thereof
US10553542B2 · kind B2 · utility
5Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2017 |
| Grant date | Feb 4, 2020 |
| Priority date | — |
| Expiry date | Jan 12, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.