Electromagnetic shielding for integrated circuit modules
US10553545B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2017 |
| Grant date | Feb 4, 2020 |
| Priority date | — |
| Expiry date | Nov 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides electromagnetic shielding for integrated circuit modules with a module-bottom sealing procedure. First a precursor package with a number of integrated modules is provided. Each integrated module includes a module substrate having a number of module contacts at a bottom surface of the module substrate. A combination of a shielding protective material and a chemical resistant tape is then applied over the bottom surface of the module substrate, such that each module contact is sealed. Next, the precursor package is singulated at each inter-module area to form a number of individual integrated modules. A shielding structure is applied completely over a side surface of each individual integrated module. Herein, the shielding structure is electrically coupled to a ground plane within the module substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.