Inventor · Lewisville, NC, US

Thomas Scott Morris

43Patents
8h-index
47Co-inventors
75Inventor score

Filing activity: Nov 4, 2003 → Jan 23, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US9613831B2 Encapsulated dies with enhanced thermal performance Electricity 201 Active
US7451539B2 Method of making a conformal electromagnetic interference shield Emerging Cross-Sectional Technologies 68 Expired
US8434220B2 Heat sink formed with conformal shield Emerging Cross-Sectional Technologies 25 Active
US9960145B2 Flip chip module with enhanced properties Electricity 13 Active
US8835226B2 Connection using conductive vias Emerging Cross-Sectional Technologies 13 Active
US9137934B2 Compartmentalized shielding of selected components Emerging Cross-Sectional Technologies 11 Active
US8296941B2 Conformal shielding employing segment buildup Emerging Cross-Sectional Technologies 10 Active
US8959762B2 Method of manufacturing an electronic module Emerging Cross-Sectional Technologies 9 Active
US9269887B1 Ultrathin flip-chip packaging techniques and configurations Electricity 8 Active
US9661739B2 Electronic modules having grounded electromagnetic shields Emerging Cross-Sectional Technologies 6 Active
US6884661B1 Method of fabricating posts over integrated heat sink metallization to enable flip chip packaging of GaAs devices Electricity 5 Expired
US7999197B1 Dual sided electronic module Electricity 4 Active
US9420704B2 Connection using conductive vias Emerging Cross-Sectional Technologies 2 Active
US9646857B2 Low pressure encapsulant for size-reduced semiconductor package Electricity 2 Active
US10905007B1 Contact pads for electronic substrates and related methods Electricity 1 Active
US9935066B2 Semiconductor package having a substrate structure with selective surface finishes Electricity 1 Active
US10888040B2 Double-sided module with electromagnetic shielding Emerging Cross-Sectional Technologies 1 Active
US10020206B2 Encapsulated dies with enhanced thermal performance Electricity 1 Active
US11765826B2 Method of fabricating contact pads for electronic substrates Electricity 0 Active
US8415567B1 Forming soldering surfaces without requiring a solder mask Emerging Cross-Sectional Technologies 0 Active
US11219144B2 Electromagnetic shields for sub-modules Electricity 0 Active
US9929125B2 Flip chip module with enhanced properties General 0 Revoked
US10777524B2 Using an interconnect bump to traverse through a passivation layer of a semiconductor die Electricity 0 Active
US10607960B2 Substrate structure with selective surface finishes for flip chip assembly Electricity 0 Active
US9899350B2 Flip chip module with enhanced properties General 0 Revoked

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.