Methods and systems for adjusting wafer deformation during wafer bonding
US10553565B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 26, 2018 |
| Grant date | Feb 4, 2020 |
| Priority date | — |
| Expiry date | Jul 26, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06593
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of methods and systems for adjusting wafer deformation during wafer bonding are provided. The method comprises: releasing inner rings of a first wafer, and applying a first gas pressure to the inner rings of the first wafer, such that the inner rings of the first wafer are in contact with a second wafer; releasing middle rings of the first wafer, such that the middle rings of the first wafer are deformed under a second gas pressure and in contact with the second wafer; releasing inner rings of the second wafer, and applying a third gas pressure less than the first gas pressure to the inner rings of the second wafer; releasing middle rings of the second wafer; and releasing outer rings of the first wafer and releasing outer rings of the second wafer simultaneously.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.