Multi-layered film, method of manufacturing the same, and manufacturing apparatus of the same
US10553777B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2015 |
| Grant date | Feb 4, 2020 |
| Priority date | — |
| Expiry date | Jun 5, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/871
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A multi-layered film includes a first electroconductive layer, a dielectric layer, and a second electroconductive layer, which are sequentially layered and disposed on a main surface of a substrate. A lower surface of the dielectric layer comes into contact with an upper surface of the first electroconductive layer, an upper surface and an side surface of the dielectric layer is coated with the second electroconductive layer, and an side end of a portion at which the first electroconductive layer directly overlaps the second electroconductive layer is located inside a side end of the substrate on the main surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.