Laser resealing with stress-reducing prestructuring

US10556789B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Frank Reichenbach · Wannweil, DE
• Jochen Reinmuth · Reutlingen, DE
• Philip Kappe · Stuttgart, DE
• Mawuli Ametowobla · Stuttgart, DE

Key dates

• Filing date: Oct 19, 2016
• Grant date: Feb 11, 2020
• Expiry date: Apr 29, 2038

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/036
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A method for manufacturing a micromechanical component including a substrate and a cap connected to the substrate and together with the substrate enclosing a first cavity, a first pressure prevailing and a first gas mixture with a first chemical composition being enclosed in the first cavity: in a first method step, an access opening, connecting the first cavity to surroundings of the micromechanical component, being formed in the substrate or in the cap; in a second method step, the first pressure and/or the first chemical composition being adjusted in the first cavity; in a third method step, the access opening being sealed by introducing energy and heat into an absorbing part of the substrate or the cap with the aid of a laser; in a fourth method step, a recess being formed, and/or an elevation being formed, and/or a reflection area being formed, and/or an absorption area being formed.