Spectrometry in integrated circuit using a photonic bandgap structure
US10557754B2 · kind B2 · utility
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31References
18Claims
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Key dates
| Filing date | Oct 31, 2017 |
| Grant date | Feb 11, 2020 |
| Priority date | — |
| Expiry date | Oct 31, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An encapsulated package is provided that includes an integrated circuit (IC) die. An encapsulation material encapsulates the IC die. A set of broadband spectral sensors on the IC die are configured to generate a set of signals in response to electromagnetic energy received by the spectral sensors. A photonic filter structure within the encapsulation material is positioned adjacent the set of spectral sensors. The photonic filter structure is configured to pass a different frequency band of electromagnetic energy to each of the set of spectral sensors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.