Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
US10559479B2 · kind B2 · utility
0Cited by
4References
16Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 12, 2018 |
| Grant date | Feb 11, 2020 |
| Priority date | — |
| Expiry date | Sep 12, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor manufacturing apparatus according to an embodiment comprises: a lid member; a support member; an oxidation resistant member; and an oxidizing system gas introducing member. The lid member is opposed to a surface of a semiconductor substrate. The support member supports the lid member. The oxidation resistant member is opposed to a back of the semiconductor substrate. The oxidizing system gas introducing member introduces an oxidizing system gas that oxidizes the back of the semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.