Substrate treatment apparatus and substrate treatment method
US10559480B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2018 |
| Grant date | Feb 11, 2020 |
| Priority date | — |
| Expiry date | Feb 7, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C15/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A substrate treatment apparatus according to the present invention is provided with a first tank that stores treatment liquid for treating a substrate and a first path that returns the treatment liquid, which has spilled over from an upper part of the first tank, to a lower part of the first tank. A second path that branches from the first path, a measurement tank that stores the treatment liquid, which has flowed in from the second path, and a pressure measurement part that measures the pressure of the treatment liquid at a predetermined depth in the measurement tank in a state in which the treatment liquid spills over from an upper part of the measurement tank are provided. Therefore, techniques for highly precisely measuring the pressure of the treatment liquid used in treatment of substrates can be provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.