2-step die attach for reduced pedestal size of laminate component packages
US10559524B1 · kind B1 · utility
2Cited by
1References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2018 |
| Grant date | Feb 11, 2020 |
| Priority date | — |
| Expiry date | Sep 17, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/92247
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged semiconductor device includes a leadframe (LF) having a plurality of laminate-supporting pedestals. A cured first die attach (DA) material is on an outer edge of the pedestals being an ultraviolet (UV)-curing DA material having a photoinitiator or a cured B-stage DA material. A cured thermally-curing DA material is on an area of the pedestals not occupied by the UV-curing DA material. A laminate component having bond pads on a top side is mounted top side up on the plurality of pedestals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.