Sadia Naseem
8Patents
2h-index
6Co-inventors
36Inventor score
Filing activity: Mar 7, 2018 → Oct 17, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10559524B1 | 2-step die attach for reduced pedestal size of laminate component packages | Electricity | 2 | Active |
| US10916448B2 | Method for creating a wettable surface for improved reliability in QFN packages | Electricity | 2 | Active |
| US11031364B2 | Nanoparticle backside die adhesion layer | Electricity | 1 | Active |
| US12255077B2 | Method for creating a wettable surface for improved reliability in QFN packages | Electricity | 0 | Active |
| US11676930B2 | Nanoparticle backside die adhesion layer | Electricity | 0 | Active |
| US11735806B2 | Wireless device with waveguiding structures between radiating structures and waveguide feeds | Electricity | 0 | Active |
| US11791168B2 | Method for creating a wettable surface for improved reliability in QFN packages | Electricity | 0 | Active |
| US11677152B2 | Packaged electronic device with integral antenna | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.