Dielectric film forming composition
US10563014B2 · kind B2 · utility
2Cited by
12References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2018 |
| Grant date | Feb 18, 2020 |
| Priority date | — |
| Expiry date | Feb 28, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/5329
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This disclosure relates to dielectric film forming composition containing at least one fully imidized polyimide polymer; at least one inorganic filler; at least one metal-containing (meth)acrylate compound; and at least one catalyst. The dielectric film formed by such a composition can have a relatively low coefficient of thermal expansion (CTE) and a relatively high optical transparency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.