Binod B. De
28Patents
4h-index
18Co-inventors
60Inventor score
Filing activity: Mar 7, 2002 → Mar 4, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6916543B2 | Copolymer, photoresist compositions thereof and deep UV bilayer system thereof | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6610808B2 | Thermally cured underlayer for lithographic application | Chemistry; Metallurgy | 12 | Expired |
| US6830870B2 | Acetal protected polymers and photoresists compositions thereof | Emerging Cross-Sectional Technologies | 10 | Expired |
| US6924339B2 | Thermally cured underlayer for lithographic application | Physics | 6 | Expired |
| US10036952B2 | Photosensitive polyimide compositions | Electricity | 3 | Active |
| US6803434B2 | Process for producing anhydride-containing polymers for radiation sensitive compositions | Physics | 2 | Expired |
| US10563014B2 | Dielectric film forming composition | Electricity | 2 | Active |
| US10781341B2 | Polyimide compositions | Emerging Cross-Sectional Technologies | 2 | Active |
| US6929897B2 | Photosensitive bilayer composition | Emerging Cross-Sectional Technologies | 2 | Expired |
| US7416821B2 | Thermally cured undercoat for lithographic application | Emerging Cross-Sectional Technologies | 2 | Expired |
| US9695284B2 | Polymer and thermosetting composition containing same | Chemistry; Metallurgy | 1 | Active |
| US7727705B2 | High etch resistant underlayer compositions for multilayer lithographic processes | Emerging Cross-Sectional Technologies | 1 | Active |
| US9617386B2 | Process for the production of polyimide and polyamic ester polymers | Chemistry; Metallurgy | 1 | Active |
| US10604628B2 | Polymer and thermosetting composition containing same | Chemistry; Metallurgy | 1 | Active |
| US11899364B2 | Photosensitive polyimide compositions | Electricity | 1 | Active |
| US8153346B2 | Thermally cured underlayer for lithographic application | Physics | 1 | Active |
| US11782344B2 | Photosensitive polyimide compositions | Electricity | 0 | Active |
| US11175582B2 | Photosensitive stacked structure | Electricity | 0 | Active |
| US10696932B2 | Cleaning composition | Physics | 0 | Active |
| US9777117B2 | Process for the production of polyimide and polyamic ester polymers | Chemistry; Metallurgy | 0 | Active |
| US8535872B2 | Thermally cured underlayer for lithographic application | Physics | 0 | Active |
| US11939428B2 | Polyimides | Chemistry; Metallurgy | 0 | Active |
| US12338309B2 | Dielectric film-forming composition | Chemistry; Metallurgy | 0 | Active |
| US11945894B2 | Dielectric film-forming composition | Chemistry; Metallurgy | 0 | Active |
| US9034557B2 | Chemically amplified positive photoresist composition | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.