Method for setting mounting position of target substrate and film forming system
US10564634B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 19, 2017 |
| Grant date | Feb 18, 2020 |
| Priority date | — |
| Expiry date | Sep 26, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/45031
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In a method for setting a mounting position of a target substrate, the test substrate is transferred to a second position deviated from a first position. A mask has expected arrangement position where a non-film formation region has a preset width when the target substrate is mounted at the first position and subjected to a film formation. The film is formed on the test substrate at the second position by using the mask. Width of the non-film formation region formed on the test substrate after the film formation is measured. Actual arrangement position of the mask is specified based on a direction and a distance of the deviation of the second position from the first position and the measured width of the non-film formation region. The first position is corrected such that the non-film formation region has the preset width based on the actual arrangement position of the mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.