Polycrystalline ceramic substrate
US10566190B2 · kind B2 · utility
2Cited by
13References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2018 |
| Grant date | Feb 18, 2020 |
| Priority date | — |
| Expiry date | Oct 16, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/018
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a ceramic substrate structure includes providing a ceramic substrate, encapsulating the ceramic substrate in a barrier layer, and forming a bonding layer coupled to the barrier layer. The method further includes removing a portion of the bonding layer to expose at least a portion of the barrier layer and define fill regions, and depositing a second bonding layer on the at least a portion of the exposed barrier layer and the fill regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.