Die attach surface copper layer with protective layer for microelectronic devices
US10566267B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 2018 |
| Grant date | Feb 18, 2020 |
| Priority date | — |
| Expiry date | May 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic device is formed by thinning a substrate of the microelectronic device from a die attach surface of the substrate, and forming a copper-containing layer on the die attach surface of the substrate. A protective metal layer is formed on the copper-containing layer. Subsequently, the copper-containing layer is attached to a package member having a package die mount area. The protective metal layer may optionally be removed prior to attaching the copper-containing layer to the package member. Alternatively, the protective metal layer may be left on the copper-containing layer when the copper-containing layer is attached to the package member. A structure formed by the method is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.