Film formation method and film formation apparatus for thin film
US10569291B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2014 |
| Grant date | Feb 25, 2020 |
| Priority date | — |
| Expiry date | May 23, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C2218/15
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method for forming a thin film having durability at a low cost is provided. A film formation apparatus 1 is used in the film formation method. The apparatus 1 comprises a vacuum container 11 in which a substrate 100 is placed at a lower part, a vacuum pump 15 for exhaust inside the container 11, a storage container 23 for storing a coating agent 21 provided outside the container 11, and a nozzle having an ejection part 19 capable of ejecting the coating agent 21 at its one end. A solution including two or more kinds of materials is used as the coating agent 21. The solution is ejected to the substrate in an atmosphere at a pressure set based on vapor pressures of respective materials composing the solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.