Patent · US Active

Wafer testing system and associated methods of use and manufacture

US10571489B2 · kind B2 · utility

0Cited by

42References

17Claims

0Family size

Inventors

Aaron Durbin · Portland, US
David William Keith · Calgary, CA
Morgan T. Johnson · Portland, US

Key dates

Filing date	Feb 15, 2017
Grant date	Feb 25, 2020
Priority date	—
Expiry date	Jun 7, 2037

Classification

Technology area (CPC G)Physics
CPC primaryG01R31/2886
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A wafer testing system and associated methods of use and manufacture are disclosed herein. In one embodiment, the wafer test system includes an interposer having a first surface and a second surface facing away from the first surface. The system also includes a wafer translator having a first side facing the second surface of the interposer and a second side facing away from the first side and toward a wafer, the first side carrying a plurality of first terminals at a first scale and the second side carrying a plurality of second terminals at a second scale. The first scale is greater than the second scale.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.