Multi-layer plasma resistant coating by atomic layer deposition
US10573497B2 · kind B2 · utility
7Cited by
37References
16Claims
0Family size
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Key dates
| Filing date | Dec 20, 2017 |
| Grant date | Feb 25, 2020 |
| Priority date | — |
| Expiry date | Dec 20, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67069
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Described herein are articles, systems and methods where a plasma resistant coating is deposited onto a surface of a chamber component using an atomic layer deposition (ALD) process. The plasma resistant coating has a stress relief layer and a layer comprising a solid solution of Y2O3—ZrO2 and uniformly covers features, such as those having an aspect ratio of about 3:1 to about 300:1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.