Cleaning apparatus and substrate processing apparatus
US10573509B2 · kind B2 · utility
0Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2017 |
| Grant date | Feb 25, 2020 |
| Priority date | — |
| Expiry date | Jun 23, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02087
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The cleaning apparatus includes multiple kinds of cleaning modules each configured to perform a cleaning processing of a substrate, a first accommodating section configured to accommodate the multiple kinds of cleaning modules therein, and a fluid supply section configured to supply a fluid to the cleaning modules accommodated in the first accommodating section through a pipe. Each of the multiple kinds of cleaning modules includes a pipe connection portion having a common connection position to be connected with the pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.