Surface structure method and apparatus associated with compute or electronic component packages
US10573580B2 · kind B2 · utility
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7Claims
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Key dates
| Filing date | Mar 31, 2017 |
| Grant date | Feb 25, 2020 |
| Priority date | — |
| Expiry date | Apr 17, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3485
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus and method associated with surface structures of compute component packages are disclosed herein. In embodiments, an apparatus may include a plurality of structures provided on a surface of a compute component package, wherein the plurality of structures are to be used to attach and electrically couple the compute component package to another device, and wherein a structure of the plurality of structures includes first and second portions, the second portion disposed further from the surface than the first portion, and the first portion to comprise a material different from the second portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.