Christopher Combs
22Patents
8h-index
21Co-inventors
75Inventor score
Filing activity: Oct 30, 1995 → Sep 18, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| USD456249S1 | Plastic package with pull tab | General | 43 | Expired |
| US6501658B2 | Heatsink mounting with shock absorbers | Electricity | 38 | Expired |
| US5671530A | Flip-chip mounting assembly and method with vertical wafer feeder | Emerging Cross-Sectional Technologies | 19 | Expired |
| US6734371B2 | Soldered heat sink anchor and method of use | Electricity | 14 | Expired |
| US6472612B2 | Printed circuit board with embedded thermocouple junctions | Electricity | 11 | Expired |
| US6700800B2 | Retainer for circuit board assembly and method for using the same | Emerging Cross-Sectional Technologies | 10 | Expired |
| US6764325B2 | Zero insertion force heat-activated retention pin | Electricity | 10 | Expired |
| US7183496B2 | Soldered heat sink anchor and method of use | Electricity | 9 | Expired |
| US6801436B2 | Extension mechanism and method for assembling overhanging components | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6875931B2 | Retainer for circuit board assembly and method for using the same | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6791035B2 | Interposer to couple a microelectronic device package to a circuit board | Emerging Cross-Sectional Technologies | 6 | Expired |
| US7251880B2 | Method and structure for identifying lead-free solder | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6791189B2 | Epoxy washer for retention of inverted SMT components | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6691407B2 | Methods for retaining assembled components | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6917524B2 | Extension mechanism and method for assembling overhanging components | Emerging Cross-Sectional Technologies | 2 | Expired |
| US7131193B2 | Heat-shrinkable retainer for PCB double-sided assembly | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6906268B2 | Heat-shrinkable retainer for PCB double-sided assembly | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6651869B2 | Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6523801B2 | Component placement | Electricity | 1 | Expired |
| US6817878B2 | Zero mounting force solder-free connector/component and method | Electricity | 0 | Expired |
| US10573580B2 | Surface structure method and apparatus associated with compute or electronic component packages | Electricity | 0 | Active |
| US11916003B2 | Varied ball ball-grid-array (BGA) packages | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.