Semiconductor devices having contact plugs overlapping associated bitline structures and contact holes
US10573653B2 · kind B2 · utility
1Cited by
26References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2019 |
| Grant date | Feb 25, 2020 |
| Priority date | — |
| Expiry date | Aug 28, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B12/488
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.