Patent · US Active

Probes for wafer sorting

US10578647B2 · kind B2 · utility

0Cited by

4References

14Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Todd P. Albertson · Warren, US
Jin Yang · Hillsboro, US
Donald E. Edenfeld · Beaverton, US

Key dates

Filing date	Sep 29, 2017
Grant date	Mar 3, 2020
Priority date	—
Expiry date	Jan 20, 2038

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB21J5/027
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Embodiments may include systems and methods for manufacturing a probe for wafer sorting or die testing. A probe for wafer sorting or die testing may include a probe body and a probe tip. The probe body may include a probe core and a probe plating layer around the probe core. The probe core may include a first material, and the probe plating layer may include a second material. The probe tip may be next to the probe core of the probe body and may include the first material. In addition, the probe tip may have an end surface that is smaller than a surface of the probe core, and larger than a single point. A probe-manufacturing device may include a forging unit, a clipping unit, and an actuation mechanism to control the forging unit and the clipping unit. Other embodiments may be described and/or claimed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.