Jin Yang
16Patents
7h-index
40Co-inventors
66Inventor score
Filing activity: Feb 23, 1993 → Sep 14, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5432859A | Noise-reduction system | Electricity | 71 | Expired |
| US5669687A | Optical projection system | Electricity | 33 | Expired |
| US5541679A | Optical projection system | Electricity | 18 | Expired |
| US5612814A | Compact sized optical projection system | Physics | 13 | Expired |
| US5560697A | Optical projection system | Electricity | 12 | Expired |
| US8926196B2 | Method and apparatus for an optical interconnect system | Emerging Cross-Sectional Technologies | 12 | Active |
| US8891235B2 | Thermal interface for multi-chip packages | Electricity | 10 | Active |
| US9366482B2 | Adjustable heat pipe thermal unit | Electricity | 2 | Active |
| US12293956B2 | Boiling enhancement structures for immersion cooled electronic systems | Electricity | 0 | Active |
| US10578647B2 | Probes for wafer sorting | Performing Operations; Transporting | 0 | Active |
| US12133357B2 | Cold plate architecture for liquid cooling of devices | Electricity | 0 | Active |
| US12262478B2 | Selectively applied protective layer on exposed materials of electronic circuit board and electronic components disposed thereon for immersion bath cooled systems | Electricity | 0 | Active |
| US10101367B2 | Microelectronic test device including a probe card having an interposer | Physics | 0 | Active |
| US12309966B2 | Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force | Electricity | 0 | Active |
| US12094800B2 | Thermally conductive slugs/active dies to improve cooling of stacked bottom dies | Electricity | 0 | Active |
| US12248344B2 | Technologies for liquid cooling interfaces | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.